BERGQUIST® GAP PAD® TGP 6000ULM
Caractéristiques et avantages
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 6000ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
En savoir plus
Documents et téléchargements
Vous cherchez une FDS ou une FT dans une autre langue ?
Documents complémentaires
Informations techniques
| Couleur | Gris |
| Température de service | -60.0 - 200.0 °C |
| Type porteur | Fibre de verre |
| Épaisseur standard | 1.524 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 6000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).