BERGQUIST® GAP PAD® TGP 1500
Známe ako Gap Pad® 1500
Vlastnosti a výhody
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Ďalšie dokumenty
Technické informácie
| Farba | Čierna |
| Prevádzková teplota | -60.0 - 200.0 °C |
| Tepelná vodivosť | 1.5 W/mK |
| Youngov modul, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Štandardná hrúbka | 0.508 - 5.08 mm |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.